General Info

Established in 1907, Williams Advanced Materials is a supplier of specialty materials used in thin film deposition and semiconductor packaging applications. The company offers a wide range of physical vapor deposition products, including sputtering materials and targets, target bonding, backing plates, evaporation materials and crucible liners. It also offers a variety of engineered materials, such as high-vacuum compound, under bond metallization, silicon, Sil-R, silver-based alloys and superior thin films. The company s physical vapor deposition materials include pure metals, precious alloys, alloys and cermets, borides, carbides, fluorides, nitrides, silicides and oxides. It has subsidiaries in Buellton, Calif., Limerick, Ireland, and Milwaukee, and manufacturing facilities in Buffalo, Wheatfield and Brewster, N.Y., Singapore, Santa Clara, Calif., Taiwan, China and Philippines.